- Ionic contamination measurements :
Enables to quantify the ionic particles at the surface of a PCB.
- Acoustic tomography:
Tomography is a non-destructive inspection technique that enables to control
the integrity of a sample
- FTIR: (Fourier Transformed InfraRed Spectroscopy):
Qualitative and quantitative analysis of organic elements.
- Vibration test.
CERB works in partnership with several companies to perform the following analyses :
ANALYSIS INTERNALLY PERFORMED:
ANALYSIS EXTERNALLY PERFORMED:
- Shear test and pull test:
Measurements of shear strengths of assembled electronic components.
- Leakage detection:
By dye penetrant.
- Dye and pry :
Pulling of BGA components after immersion into a dye solution. This test enables to locate the distribution of the cracked solder joints for all BGA balls.
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